According to a report of WinFuture.de from Germany, Huawei is expected to introduced their latest Kirin 970 SoC at IFA Berlin 2017. The new SoC is said to be manufactured on the 10nm process, which is in-line with the competition from Qualcomm, Exynos, MediaTek. The Kirin 970 is rumored to include 8 CPU cores, 12 GPU cores and a dual ISP.
With 5.5 billion transistors, it has reportedly overcome the 2.5 billion transistors on the Snapdragon 835. Although transistor count isn’t the main factor for the performance of a chipset, if you considered the Kirin 960 had 4 billion transistors and is also a generation behind the Snapdragon 835. The Kirin 960 actually bet the Snapdragon 820 in single core performance test, so we should not put the Kirin chipset out of the chipset competition. The Snapdragon 820 only won out the Kiri 960 in the graphics capabilities and multi-core performance, as the Adreno GPU line has been dominating the Android world for many years, but the Kirin has always been a serious competitor.
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Moreover, the chip is reportedly equipped with advanced artificial intelligence computing capabilities, which is claimed to be 25 times faster than the normal CPU core and 50 times more efficient. With the Kirin 970, Huawei plans to bring a better and more powerful artificial intelligence into its devices, which is very great especially when artificial intelligence can learn user’s tendencies. It can also be used for preloading apps, more helpful notifications and more, though there are not truly noticeable improvements with these kinds of implementations.
We’ll pay more attention at the Kirin 970 when it’s launched. The chipset is expected to be integrated in the Huawei Mate 10 which will be launching in the next few months. It’s great to see more competitions from other OEM manufacture chipsets, so we are now eager to see HiSilicon.